copper; silver; tin
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Descriptors Computed from Structure
Canonical SMILES:
[Cu].[Cu].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn]
Isomeric SMILES
[Cu].[Cu].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn]
InChI
InChI=1S/5Ag.2Cu.3Sn
Other Product
- 2,5-bis(chloranyl)cyclohexa-2,5-diene-1,4-diol
- 2,5-bis(chloranyl)benzene-1,4-diol
- 2,5-bis(chloranyl)phenol
- 2-oxidanylidenehexanedioic acid
- 2-oxidanylidene-3-sulfanyl-propanoic acid
- 3-oxidanylbenzaldehyde
- 3-azanylpropanal
- 2-azanyl-3-oxidanyl-benzoic acid
- 3-(3-hydroxyphenyl)propanoic acid
- 3-oxidanylidenehexanedioic acid
- diethoxymethyl(3-piperidin-1-ylpropyl)silicon
- (E)-2-oxidanyl-2-[[3-(pyridin-2-yldisulfanyl)phenyl]methoxy]ethenediazonium
- diethoxymethyl(3-morpholin-4-ylpropyl)silicon
- copper; silver; tin
- 3-azanylpropyl(2,2-diethoxyethyl)silicon
- diethoxymethyl-[3-(4-methylpiperazin-1-yl)propyl]silicon
- 3-[18-(2-carboxyethyl)-3,7,8,12,12,17-hexamethyl-13-oxidanylidene-21,24-dihydroporphyrin-2-yl]propanoic acid
- (5Z)-5-[(dipentylamino)hydrazinylidene]imidazole-4-carboxamide
- (5Z)-5-(propylaminohydrazinylidene)imidazole-4-carboxamide
- 2-diethylaminoethylsulfanyl-methyl-oxidanylidene-phosphanium
