copper(1+); lead
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Descriptors Computed from Structure
Canonical SMILES:
[Cu+].[Pb]
Isomeric SMILES
[Cu+].[Pb]
InChI
InChI=1S/Cu.Pb/q+1;
Other Product
- 2,5-bis(chloranyl)cyclohexa-2,5-diene-1,4-diol
- 2,5-bis(chloranyl)benzene-1,4-diol
- 2,5-bis(chloranyl)phenol
- 2-oxidanylidenehexanedioic acid
- 2-oxidanylidene-3-sulfanyl-propanoic acid
- 3-oxidanylbenzaldehyde
- 3-azanylpropanal
- 2-azanyl-3-oxidanyl-benzoic acid
- 3-(3-hydroxyphenyl)propanoic acid
- 3-oxidanylidenehexanedioic acid
- 2,5-dinaphthalen-1-yl-3H-1,2,3-oxadiazole
- dimethoxy-[2,3,3,4,4,5,5,6,6,7,8,9,9-tridecakis(fluoranyl)nonyl]silicon
- [3,4,4,5,5,6,6,7,7,8,9,10,10-tridecakis(fluoranyl)-2-methyl-decan-2-yl]oxysilicon
- 4-[[1-(hydroxymethyl)cyclohexyl]methoxycarbonyl]benzoate
- 4-[[1-(hydroxymethyl)cyclohexyl]methoxycarbonyl]benzoic acid
- [1,3-bis(chloranyl)propyl-dimethyl-silyl]oxysilicon
- (6E)-6-spiro[2.2]pentan-5-ylidenespiro[2.3]hexane
- 3-[(2-azanylethylamino)methyl]-3-[bis(2-hydroxyethyl)amino]pentane-1,5-diol
- magnesium gadolinium(3+) borate
- butyl 2-methylprop-2-enoate; pyrrolidin-2-one
